MWC 2026: Qualcomm Unveils FastConnect 8800 X105 5G Modem-RF With Wi-Fi 8; Snapdragon Wear Elite Announced

The Mobile World Congress (MWC) 2026 on Monday, Qualcomm announced two major connectivity solutions that aim to power next-generation smartphones and connected devices. Known as the Qualcomm FastConnect 8800 Mobile Connectivity System and the new Qualcomm X105 5G Modem-RF System, the newly launched platforms focus on Wi–Fi 8, Bluetooth 7, proximity-based AI experiences (and AI-powered 5g Advanced connectivity). In addition to that, the chipmaker announced a further announcement of his own name “The chip maker also has said it is .”

Qualcomm FastConnect 8800 Mobile Connectivity System

Designed as an integrated mobile connectivity solution, Qualcomm FastConnect 8800 is designed to be the single chip that integrates with Wi-Fi 8, Bluetooth 7, Ultra Wideband and Thread according to the 6nm process. The FastConnect 8800, Qualcomm said, has a 4×4 radio architecture and can reach Wi-Fi speeds of up to 11 “[clarification needed] according to the fastconnect 8 800.” The term “6Gbpsbps” is a phrase that .

This, the company claims, is a big step up from the previous generation, with “double-digit improvements” achieved.

Compared to the previous product, Qualcomm says it has up to three times longer gigabit ranges than its predecessor “This is achieved through the 4×4 architecture, new RF front-end modules (QXM110t and QXMS210x), Wi-Fi 8 ELR features.” System supports 6GHz, 5GHz and 2GHz. A 4GHz band with more advanced features like 320MHz channel bandwidth, MU-MIMO (uplink and downlink), OFDMA or Target Wake Time are all available in 4G bands.

FastConnect 8800 also integrates Bluetooth 7 with Bluetooth Channel Sounding, Snapdragon Sound, Qualcomm XPAN, LE Audio and aptX technologies. Qualcomm has announced a Proximity AI stack that integrates Wi-Fi Ranging, Bluetooth Channel Sounding and UWB on the near side of proximity. This allows for direction and distance tracking of devices, and it can use GPS to track down lost devices worldwide according to the company.

Qualcomm says the FastConnect 8800 platform is targeted at high-end smartphones, allowing multi-device experiences, spatial audio support and improved device discovery.

Qualcomm X105 5G Modem-RF System

The X105 5G Modem-RF is also announced by Qualcomm as its new flagship modem platform for 5g advanced networks. X105 has been designed by the company, which says it is “a new architecture for AI-powered 5G advanced connectivity” (i.e. X105 modem is built into a fifth-generation 5G AI processor, which claims to provide agentic AI experiences such as network and congestion, mobility and behaviour predictive optimisation.

The chipmaker also has a sophisticated sensing software, which detects and predicts RF conditions to boost 5G connectivity reliability with the new modem platform. A new RF transceiver design claims that the X105 is said to be 30 percent less power consumption than its predecessor, and 15 percent smaller footprint.

The platform also introduces next-generation RF front-end components such as new power amplifier modules and the QET8200 envelope tracker for higher power efficiency. The X105 also supports integrated NR-NTN (Non-Terrestrial Network) connectivity on the satellite front, which allows 5G over satellite for video, data, voice and messaging services in off-grid environments.

Also, it includes a multi-constellation, quad-frequency support (L1, L2, L5, L6) next generation GNSS engine that seeks to improve location accuracy while providing up to 25 percent power savings. Next flagship smartphones will be launched later in 2026, with Qualcomm’s new modem platform.

Snapdragon Wear Elite

In addition to its connectivity announcements, Qualcomm launched a new Snapdragon Wear platform at MWC. It’s designed to power the next generation of AI-powered wearables, known as Snapdragon Wear Elite and is aimed at driving the new generation. The new chipset, which the company said is designed to support what it calls as “rise of personal AI,” will allow for more sophisticated on-device intelligence in smartwatches and other wearable form factors.

The Snapdragon Wear Elite platform focuses on the more advanced AI processing, higher power efficiency and better connectivity integration for its users. The chipset, according to Qualcomm, is optimised for running on-device AI workloads allowing features such as contextual awareness, health tracking insights and personalised support.

The platform, which was designed to work in a seamless manner with Qualcomm’s wider ecosystem (fastConnect connectivity technologies and its new 5G solutions) is also part of the network’. The chipmaker also emphasized support for more advanced Bluetooth audio, low-power operation and improved sensor integration for fitness and health monitoring. Next year, the next high-end wearable devices will be powered by a newer model of Snapdragon Wear Elite that is expected to launch later this year.