Oppo Find X9s to Launch in Global Markets Including India With MediaTek Dimensity 9500s SoC: Report

Oppo seems to be gearing up for its next flagship launch, with new leaks revealing the future of Find X9s. This latest report says that the handset could launch with MediaTek’s new Dimenson 9500S chipset in India and other markets, making it an early adopter of the company’ upcoming efficiency-focused flagship silicon. Along with processor details, rumours also point to a high-end design, advanced camera hardware and large battery as Oppo prepares for preparing for the mid-year release window.

Oppo Find X9s Said to Be Among First Phones in India With Dimensity 9500s SoC

A report from a Smartprix says the Oppo Find X9s is “among the first smartphones in India” to be equipped with the new MediaTek Dimensity 9500s chipset. MediaTek’s “s” series aims to deliver good flagship performance, with the Dimensity 9500s built on a 3nm process. It is alleged to perform near-Dimensity 9500 performance with improved thermal control for sustained gaming.

Oppo is reportedly targeting a launch of the Q2 2026 for the Find X9s in India and other South Asian markets to pursue mid-year flagship refreshes. Similarly, it is expected to be delivered in countries such as Vietnam (the country of Malaysia), Singapore and more. It supports an earlier leak, which suggested the Oppo Find X9s and Read-x9. Ultra will be launched in select global markets this year with Q2 next year, according to this claim.

It is believed that the rumoured Oppo Find X9s may be based on features from the new Find-X9. Pro, which will launch in China soon with a compact 6. 3 inch1 . Displays of 5K AMOLED 120Hz are a bit . It may also be marketed as LIPO to get slimmer bezels on all four sides. The Find X9s also is expected to have a triple rear camera setup, with ‘200-megapixel main sensor and 200-MP telephoto lens’.

A battery around the 7,000mAh mark is expected to support Oppo’s alleged Find X9s handset, which has been claimed to be an antenna for wireless charging and will also have its own device supported by a battery that supports this feature. A 3D ultrasonic fingerprint sensor for biometric authentication and a full water-resistant device would be included in the handset.